2018 IEEE VR Los Angeles logo
2018 IEEE VR Los Angeles logo

In Cooperation with
the German Association for Electrical, Electronic and Information Technologies: VDE

VDE Logo ITG Logo
IEEE Computer Society IEEE

Exhibitors and Supporters

IEEE Virtual Reality International Program Committee

Journal Papers

  • Adcock, Matt , Commonwealth Scientific and Industrial Research Organisation (CSIRO), AU
  • Ammi, Mehdi , University of Paris-Sud, FR
  • Argelaguet, Ferran, INRIA, FR
  • Benko, Hrvoje, Microsoft Research, US
  • Billinghurst, Mark, University of South Australia, AU
  • Boulic, Ronan , EPFL, CH
  • Bowman, Doug, Virginia Tech, US
  • Bruder, Gerd, University of Central Florida, US
  • Chen, Jian, The Ohio State University, US
  • Coquillart, Sabine, INRIA, FR
  • DiVerdi, Stephen, Adobe, US
  • Doerner, Ralf, RheinMain University of Applied Sciences, DE
  • Duval, Thierry , Lab-STICC, IMT Atlantique, FR
  • Dwyer, Tim, Monash University, AU
  • Feiner, Steven, Columbia University, US
  • Figueroa, Pablo, Universidad de los Andes, CO
  • Gabbard, Joe, Virginia Tech, US
  • Hoang, Thuong, Deakin University, AU
  • Hu, Shi-Min, Tsinghua University, CN
  • Itoh, Yuta, Keio University, JP
  • Johnsen, Kyle, University of Georgia, US
  • Jones, Adam, University of Mississippi, US
  • Jorge, Joaquim, INESC-ID, Universidade de Lisboa, PT
  • Julier, Simon, University College London, UK
  • Kalkofen, Denis, Graz University of Technology, AT
  • Keefe, Daniel, University of Minnesota, US
  • Kim, Gerard, Korea University, KR
  • Kopper, Regis , Duke University, US
  • Kuroda, Yoshihiro, Osaka University, JP
  • Laha, Bireswar, Stanford University, US
  • Langlotz, Tobias, University of Otago, NZ
  • Lin, Ming, University of North Carolina, US
  • Moreau, Guillaume, Ecole Centrale de Nantes, FR
  • Nilsson, Niels Christian, Aalborg University Copenhagen, DK
  • Olivier, Anne-Hélène, University Rennes 2, FR
  • Reiners, Dirk, University of Arkansas at Little Rock, US
  • Pan, Ye, University College London, UK
  • Sadagic, Amela , Naval Postgraduate School, US
  • Serafin, Stefania, Aalborg University Copenhagen, DK
  • Steed, Anthony, University College London, UK
  • Sugimoto, Maki, Keio University, JP
  • Suma Rosenberg, Evan, University of Southern California, US
  • Stürzlinger, Wolfgang, Simon Fraser University, CA
  • Swan II, J. Edward, Mississippi State University, US
  • Takashima, Kazuki, Tohoku University, JP
  • Tanikawa, Tomohiro, University of Tokyo, JP
  • Teichrieb, Veronica, Federal University of Pernambuco, BR
  • Trutoiu, Laura , Magic Leap, US
  • Wang, Dangxiao, Beihang University, CN
  • Wimmer, Michael, TU Wien, AT
  • Yanagida, Yasuyuki, Meijo University, JP
  • Yang, Xubo, Shanghai Jiao Tong University, CN
  • Yu, Lap-Fai, University of Massachusetts Boston, US
  • Zachmann, Gabriel, University of Bremen, DE

Conference Papers

  • Ammi, Mehdi, University of Paris-Sud, France
  • Anderson, Fraser, Autodesk, Canada
  • Annett, Michelle, MishMashMakers, Canada
  • Arya, Ali, Carleton University, Canada
  • Banic, Amy, University of Wyoming, USA
  • Billinghurst, Mark, University of South Australia, Australia
  • Borst, Christoph, University of Louisiana at Lafayette, USA
  • Boulic, Ronan, EPFL, Switzerland
  • Bowman, Doug, Virginia Tech, USA
  • Bruder, Gerd, University of Central Florida, USA
  • Cho, Isaac, University of North Carolina at Charlotte, USA
  • Coquillart, Sabine, Infria, France
  • Daiber, Florian, DFKI, Germany
  • Diverdi, Stephen, Adobe, USA
  • Duval, Thierry, IMT Atlantique, France
  • Ens, Barrett, University of South Australia, Australia
  • Ferrise, Francesco, Politecnico di Milano, Italy
  • Figueroa, Pablo, Universidad de los Andes, Colombia
  • Gabbard, Joe, Virginia Tech, USA
  • Guo, Rongkai, Kennesaw State University, USA
  • Hoang, Thuong, Deakin University, Australia
  • Interrante, Victoria, University of Minnesota, USA
  • Isenberg, Tobias, Inria, France
  • Itoh, Yuta, Keio University, Japan
  • Iwai, Daisuke, Osaka University, Japan
  • Jackson, Bret, Macalester College, USA
  • Jenkin, Michael, York University, Canada
  • Johnsen, Kyle, University of Georgia, USA
  • Kalkofen, Denis, Graz University of Technology, Austria
  • Katzakis, Nicholas, University of Hamburg, Germany
  • Kim, Gerard, Korea University, Korea
  • Kuhlen, Torsten , RWTH Aachen University, Germany
  • Kulik, Alexander, Bauhaus-Universität Weimar, Germany
  • Kuroda, Yoshihiro, Osaka University, Japan
  • Laha, Bireswar, Stanford University, USA
  • Lindeman, Robert, University of Canterbury, New Zealand
  • Lopes, Pedro, Hasso Plattner Institut, Germany
  • Martinez-Plasencia, Diego, University of Sussex, United Kingdom
  • McMahan, Ryan, University of Texas at Dallas, USA
  • Mestre, Daniel, CNRS, France
  • Molina Masso, Jose Pascual, University of Castilla-La Mancha, Spain
  • Nedel, Luciana, Federal University of Rio Grande do Sul, Brazil
  • Normand, Jean-Marie, Ecole Centrale de Nantes, France
  • Ortega, Francisco, Florida International Univeristy, USA
  • Pan, Ye, University College London, United Kingdom
  • Peck, Tabitha, Davidson College, USA
  • Plopski, Alexander, Nara Institute of Science and Technology, Japan
  • Ponto, Kevin, University of Wisconsin - Madison, USA
  • Powell, Wendy, University of Portsmouth, United Kingdom
  • Quarles, John, University of Texas at San Antonio, USA
  • Sanders, Betsy, Rhodes College, USA
  • Schöning, Johannes, University of Bremen, Germany
  • Simeone, Adalberto, University of Leuven, Belgium
  • Steed, Anthony, University College London, United Kingdom
  • Suma Rosenberg, Evan, University of Southern California, USA
  • Swan II, J. Edward, Mississippi State University, USA
  • Teichrieb, Veronica, Federal University of Pernambuco, Brazil
  • Valkov, Dimitar,  University of Münster, Germany
  • Weyers, Benjamin, RWTH Aachen University, Germany
  • Yamamoto, Goshiro, Kyoto University Hospital, Japan
  • Yanagida, Yasuyuki, Meijo University, Japan
  • Yang, Xubo, Shanghai Jiao Tong University, China
  • Zachmann, Gabriel, University of Bremen, Germany